| PART |
Description |
Maker |
| DWS-2F3883P20 DWS-2F3883P22 DWS-2F3883P23 DWS-2F38 |
WDM,Filter, 200 GHz, ITU Component
|
http://
JDS Uniphase Corporation
|
| DWS-1F3883P20 DWS-1F3883P22 DWS-1F3883P23 DWS-1F38 |
WDM,Filter, 100 GHz, ITU Component
|
JDS Uniphase Corporation
|
| MF699ST MF699 |
0.5V WDM duplex device, for datacom, telecom and general purpose applications
Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device
Datacom, Video Link, Intra-Office Telecom, WDM(Wavelength Division Multiplex) Duplex Device(用于数据通信，视频连接，内部办公通信，波长多路复用（WDM）的双工设备)
|
Mitel Semiconductor
MITEL[Mitel Networks Corporation]
Mitel Networks Corporat...
|
| DWM-2F4DS2720 DWM-2F8DS2720 DWM-2FSDS2720 DWM-2F4D |
FIBER OPTIC WAVELENGTH DIVISION MUX/DEMUX, 200GHz, PANEL MOUNT, FC/APC CONNECTOR
FIBER OPTIC WAVELENGTH DIVISION MUX/DEMUX, 200GHz, PANEL MOUNT, SC/SPC CONNECTOR
Multi-Channel Mux/Demux Module 200 GHz Spacing
|
JDS Uniphase Corporation
http://
|
| CB1SLU3215533290653 CB1SLU1115533290653 CB1HLU1115 |
100GHz WDM Filter Components for OADM
|
Bookham, Inc.
http://
|
| BM-10EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
5X7 DOT MATRIX DISPLAY, HIGH EFFICIENCY RED/YELLOW GREEN, 30.48 mm
|
BRIGHT LED ELECTRONICS CORP
AMERICAN BRIGHT OPTOELECTRONICS CORP
|
| SSB-COB13340SYW-B |
SINGLE COLOR DISPLAY CLUSTER, SUPER YELLOW, 133 mm
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
133mm x 40mm V.A. SUPER YELLOW LED BACKLIGHT, CHIPS ON BOARD, 132 CHIPS, 4.2V 660mA
|
ETC
LUMEX INC.
List of Unclassifed Manufacturers
|
| BM-41EG57MD |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-10EG88ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| BM-20EG57ND |
hi-eff red chips and green chips, the hi-eff red chips are made from GaAsP on GaP substrate, the green chips are made from GaP on GaP substrate.
|
BRIGHT LED ELECTRONICS CORP
|
| MWDMG00500022H1 MWDMG00500022H2 MWDMG00500022H3 MW |
Micro-Optic WDM
|
OPLINK Communications Inc.
|
